Manufacturer | Part # | Datasheet | Description |
Pepperl+Fuchs Inc. |
OIT500-F113-B17-CB
|
951Kb / 4P |
High temperature identification system
|
TE Connectivity Ltd |
ZHD-SCE
|
2Mb / 4P |
HEAT SHRINK IDENTIFICATION SYSTEM
|
Pepperl+Fuchs Inc. |
OIT300-F113-B12-CB2
|
316Kb / 3P |
High temperature identification system
|
OIT500-F113-B12-CB3
|
728Kb / 5P |
High temperature identification system
|
OIT1500-F113-B12-CB
|
317Kb / 3P |
High temperature identification system
|
OIT200-F113-B12-CB
|
348Kb / 3P |
High temperature identification system
|
OIT500-F113-B12-CB
|
312Kb / 3P |
High temperature identification system
|
NXP Semiconductors |
TDA3576B
|
660Kb / 13P |
SYNC COMBINATION WITH TRANMITTER IDENTIFICATION AND VERTICAL 624 DIVIDER SYSTEM
November 1982 |
TDA3571B
|
529Kb / 11P |
SYNC COMBINATION WITH TRANSMITTER IDENTIFICATION AND VERTICAL 625 DIVIDER SYSTEM
October 1982 |
Balluff Korea Ltd. |
BVS001C
|
180Kb / 3P |
Optical Identification
0.52_2021-12-17 |